參數(shù)資料
型號(hào)： 80960RM
廠商： Intel Corp.
英文描述： 80960RM I/O Processor(80960RM I/O 處理器)
中文描述： 80960RM I / O處理器（80960RM的I / O處理器）
文件頁數(shù)： 5/54頁
文件大?。?/td> 855K
代理商： 80960RM
Advance Information
v
Data Sheet
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80960RM
Figures
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80960RM Functional Block Diagram............................................................... 8
80960JT Core Block Diagram ....................................................................... 11
540L H-PBGA Package Diagram (Top and Side View) ................................ 25
540L H-PBGA Package Diagram (Bottom View) .......................................... 26
Thermocouple Attachment - A) No Heatsink / B) With Heatsink................... 37
VCC5REF Current-Limiting Resistor............................................................. 42
V
CCPLL
Lowpass Filter .................................................................................. 42
P_CLK, TCLK, DCLKIN, DCLKOUT Waveform............................................ 50
T
OV
Output Delay Waveform......................................................................... 50
T
OF
Output Float Waveform.......................................................................... 51
T
IS
and T
IH
Input Setup and Hold Waveform................................................ 51
I
2
C Interface Signal Timings.......................................................................... 51
AC Test Load (all signals except SDRAM and Flash signals)....................... 52
Tables
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Related Documentation................................................................................... 7
Instruction Set .............................................................................................. 14
Pin Description Nomenclature....................................................................... 16
Memory Controller Signals............................................................................ 17
Primary PCI Bus Signals............................................................................... 20
Secondary PCI Arbiter Signals...................................................................... 21
Secondary PCI Bus Signals.......................................................................... 22
JX Core Signals and Configuration Straps.................................................... 23
I
2
C, JTAG, Core Signals ............................................................................... 24
540-Lead H-PBGA Package
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Signal Name Order..................................... 27
540-Lead H-PBGA Pinout
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Ballpad Number Order.................................... 32
540-Lead H-PBGA Package Thermal Characteristics .................................. 38
Heat Sink Vendors and Contacts .................................................................. 39
Socket-Header Vendor.................................................................................. 40
Burn-in Socket Vendor .................................................................................. 40
Shipping Tray Vendor.................................................................................... 40
Logic Analyzer Interposer Vendor................................................................. 40
JTAG Emulator Vendor................................................................................. 40
Operating Conditions..................................................................................... 41
V
DIFF
Specification for Dual Power Supply Requirements (3.3 V, 5 V)......... 42
DC Characteristics ........................................................................................ 43
I
CC
Characteristics ........................................................................................ 44
Input Clock Timings....................................................................................... 44
SDRAM Output Clock Timings...................................................................... 45
PCI Signal Timings....................................................................................... 46
JN Core Signal Timings................................................................................. 47
SDRAM / Flash Signal Timings..................................................................... 47
Boundary Scan Test Signal Timings ............................................................. 48
I2C Interface Signal Timings ......................................................................... 49
Device ID Registers....................................................................................... 53
相關(guān)PDF資料
PDF描述
80960RN 80960RN I/O Processor(80960RN I/O 處理器)
80960SA Embedded 32-Bit Microprocessor With 16-Bit Burst Data Bus(帶有16位脈沖串?dāng)?shù)據(jù)總線的嵌入式 32-BIT微處理器)
80960SB Embedded 32-Bit Microprocessor With 16-Bit Burst Data Bus(帶有16位脈沖串?dāng)?shù)據(jù)總線的嵌入式 32-BIT微處理器)
8097JF COMMERCIAL/EXPRESS HMOS MICROCONTOLLER
8098 COMMERCIAL/EXPRESS HMOS MICROCONTROLLER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
80960SA 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS
80960SB 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS
80961-01 制造商:Glenair 功能描述:EARTH BOND M10 FOR AL 4MM T
809621-000 制造商:TE Connectivity 功能描述:809621-000
80963 制造商:3M Electronic Products Division 功能描述:Tape Temflex 1500 Brown 15mmx10m
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