參數(shù)資料
型號: 72SD3232RPFE
廠商: MAXWELL TECHNOLOGIES
元件分類: DRAM
英文描述: 1 Gbit SDRAM 32-Meg X 32-Bit X 4-Banks
中文描述: 32M X 32 SYNCHRONOUS DRAM, 6 ns, DFP72
封裝: STACK, DFP-72
文件頁數(shù): 20/41頁
文件大?。?/td> 596K
代理商: 72SD3232RPFE
72SD3232
M
20
All data sheets are subject to change without notice
2005 Maxwell Technologies
All rights reserved.
1 Gbit(32-Meg X 32-Bit X 4-Banks) SDRAM
02.04.05 Rev 3
Operation of the SDRAM
The following section shows operation examples of 72SD3232.
Note: The SDRAMshould be used according to the product capability ( See Pin Description and AC
Characteristics.)
Read/Write Operations:
Bank Active:
Before executing a read or write operation, the corresponding bank and the row address must
be activated by the bank active (ACTV) command. An interval of t
RCD
is required between the bank active
command input and the following read/write command input.
Read operation:
A read operation starts when a read command is input. The output buffer becomes Low-Z
in the (CAS latency - 1) cycle after read command set. The SDRAMcan performa burst read operation.
The burst length can be set to 1, 2, 4, or 8. The start address for a burst read is specified by the column
address and the bank select address (BA0/BA1) at the read command set cycle. In a read operation, data
output starts after the number of clocks specified by the CAS latency. The CAS latency can be set to 2 or 3.
When the burst length is 1, 2, 4, or 8, the D
buffer automatically becomes High-Z at the next clock after
the successive burst-length data has been output.
The CAS latency and burst length must be specified at the mode register.
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