參數(shù)資料
型號: 5962-0720601VXC
元件分類: ADC
英文描述: 3-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP52
封裝: CERAMIC, QFP-52
文件頁數(shù): 2/21頁
文件大?。?/td> 433K
代理商: 5962-0720601VXC
THERMAL CHARACTERISTICS
THERMAL NOTES
1.00
10.00
100.00
1000.00
80
90
100
110
120
130
140
150
160
170
180
Continuous Tj (°C)
Y
e
a
rs
e
s
ti
m
a
te
d
li
fe
Electromigration Fail Mode
SLWS194 – MAY 2008 ....................................................................................................................................................................................................... www.ti.com
PARAMETER
TEST CONDITIONS
TYP
UNIT
RθJA
Junction-to-free-air thermal resistance
Board Mounted, Per JESD 51-5 methodology
21.81
°C/W
RθJC
Junction-to-case thermal resistance
MIL-STD-883 Test Method 1012
0.849
°C/W
This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the
bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is
required on the surface of the PCB directly underneath the body of the package. During normal surface mount
flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an
efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a
thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat
removal. TI typically recommends an 11,9-mm2 board-mount thermal pad. This allows maximum area for thermal
dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of
thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad
must be electrically at ground potential.
Figure 2. ADS5424 Estimated Device Life at Elevated Temperatures Electromigration Fail Mode
10
Copyright 2008, Texas Instruments Incorporated
Product Folder Link(s): ADS5424-SP
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