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參數(shù)資料
| 型號： | XRT73R12 |
| 廠商： | Exar Corporation |
| 英文描述： | TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT |
| 中文描述： | 第十二章通道E3/DS3/STS-1線路接口單元 |
| 文件頁數(shù)： | 33/87頁 |
| 文件大?。?/td> | 436K |
| 代理商： | XRT73R12 |
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PRELIMINARY
XRT73R12
REV. P1.0.3
TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT
30
4.4
The Transmit Pulse Shaper converts the B3ZS encoded digital pulses into a single analog Alternate Mark
Inversion (AMI) pulse that meets the industry standard mask template requirements for STS-1 and DS3. For
E3 mode, the pulse shaper converts the HDB3 encoded pulses into a single full amplitude square shaped
pulse with very little slope. The Pulse Shaper Block also includes a Transmit Build Out Circuit, which can
either be disabled or enabled by setting the TxLEV_n bit to “1” or “0” in the control register. For DS3/STS-1
rates, the Transmit Build Out Circuit is used to shape the transmit waveform that ensures that transmit pulse
template requirements are met at the Cross-Connect system. The distance between the transmitter output and
the Cross-Connect system can be between 0 to 450 feet. For E3 rate, since the output pulse template is
measured at the secondary of the transformer and since there is no Cross-Connect system pulse template
requirements, the Transmit Build Out Circuit is always disabled. The differential line driver increases the
transmit waveform to appropriate level and drives into the 75
load as shown in Figure 20.
F
IGURE
20. T
RANSMIT
P
ULSE
S
HAPE
T
EST
C
IRCUIT
T
RANSMIT
P
ULSE
S
HAPER
4.4.1
If the distance between the transmitter and the DSX3 or STSX-1, Cross-Connect system, is less than 225 feet,
enable the Transmit Build Out Circuit by setting the TxLEV_n control bit to “0”. If the distance between the
transmitter and the DSX3 or STSX-1 is greater than 225 feet, disable the Transmit Build Out Circuit.
Guidelines for using Transmit Build Out Circuit
F
IGURE
19. HDB3 E
NCODING
F
ORMAT
0
0
0
0
0
1
1
1
1
1
1
V
B
V
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
V
0
0
0
TClk
Line
Signal
TPDATA
TTIP(n)
TRing(n)
1:1
R3
75
TxPOS(n)
TxNEG(n)
TxLineClk(n)
TPData(n)
TNData(n)
TxClk(n)
31.6
+ 1%
31.6
+1%
R1
R2
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| XRT73R12IB | TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XRT73R12_07 | 制造商:EXAR 制造商全稱:EXAR 功能描述:TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT |
| XRT73R12_0710 | 制造商:EXAR 制造商全稱:EXAR 功能描述:TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT |
| XRT73R12ES | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| XRT73R12IB | 功能描述:外圍驅(qū)動器與原件 - PCI RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| XRT73R12IB-F | 功能描述:外圍驅(qū)動器與原件 - PCI RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
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