參數(shù)資料
型號: XPC862PZP50
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
封裝: PLASTIC, BGA-357
文件頁數(shù): 78/82頁
文件大?。?/td> 530K
代理商: XPC862PZP50
8
MPC862 Family Hardware Specications
MOTOROLA
Power Dissipation
Part V Power Dissipation
Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,
and 2:1 mode, where CPU frequency is twice bus speed.
Part VI DC Characteristics
Table 5 provides the DC electrical characteristics for the MPC862.
5
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to
case thermal resistance is a simulated value from the junction to the exposed pad without contact
resistance.
6
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
Table 4. Power Dissipation (PD)
Die Revision
Frequency
Typical 1
1
Typical power dissipation is measured at 3.3V.
Maximum 2
2
Maximum power dissipation is measured at 3.5V.
NOTE
Values in Table 4 represent VDDL based power dissipation and do not
include I/O power dissipation over VDDH. I/O power dissipation varies
widely by application due to buffer current, depending on external
circuitry.
Unit
0
(1:1 Mode)
50 MHz
656
735
mW
66 MHz
TBD
mW
0
(2:1 Mode)
66 MHz
722
762
mW
80 MHz
851
909
mW
Table 5. DC Electrical Specications
Characteristic
Symbol
Min
Max
Uni t
Operating voltage at 40 MHz or less
VDDH, VDDL, VDDSYN
3.0
3.6
V
KAPWR (power-down mode) 2.0
3.6
V
KAPWR (all other operating
modes)
VDDH - 0.4 VDDH
V
Operating voltage greater than 40 MHz
VDDH, VDDL, KAPWR,
VDDSYN
3.135
3.465
V
KAPWR (power-down mode) 2.0
3.6
V
KAPWR (all other operating
modes)
VDDH - 0.4 VDDH
V
Input High Voltage (all inputs except EXTAL and EXTCLK) VIH
2.0
5.5
V
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