參數(shù)資料
型號(hào)： XPC862PZP50
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
封裝： PLASTIC, BGA-357
文件頁(yè)數(shù)： 2/82頁(yè)
文件大?。?/td> 530K
代理商： XPC862PZP50
10
MPC862 Family Hardware Specications
MOTOROLA
Thermal Calculation and MeasurementEstimation with Junction-to-Case Thermal Resistance
where:
TA = ambient temperature C
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ-TA) are possible.
7.2
Estimation with Junction-to-Case Thermal
Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (C/W)
RθJC = junction-to-case thermal resistance (C/W)
RθCA = case-to-ambient thermal resistance (C/W)
RθJC is device related and cannot be inuenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air ow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat ows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal
Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two resistor
model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the
top of the package. The junction-to-board thermal resistance describes the thermal performance when most
of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of
most plastic packages and especially PBGA packages is strongly dependent on the board temperature; see
Figure 2.
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