參數(shù)資料
型號: XCV812E-8BG560C
廠商: Xilinx Inc
文件頁數(shù): 16/118頁
文件大小: 0K
描述: IC FPGA 1.8V C-TEMP 560-MBGA
產(chǎn)品變化通告: FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝: 1
系列: Virtex®-E EM
LAB/CLB數(shù): 4704
邏輯元件/單元數(shù): 21168
RAM 位總計: 1146880
輸入/輸出數(shù): 404
門數(shù): 254016
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 560-LBGA,金屬
供應(yīng)商設(shè)備封裝: 560-MBGA(42.5x42.5)
Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
Module 4 of 4
DS025-4 (v3.0) March 21, 2014
36
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
NA
VCCO_7
F2
NA
VCCO_7
R12
NA
VCCO_7
P12
NA
VCCO_7
N12
NA
VCCO_7
R11
NA
VCCO_7
P11
NA
VCCO_7
P8
NA
VCCO_7
M3
NA
GND
Y18
NA
GND
AH7
NA
GND
AK30
NA
GND
AJ30
NA
GND
B30
NA
GND
A30
NA
GND
AK29
NA
GND
AJ29
NA
GND
AC29
NA
GND
H29
NA
GND
B29
NA
GND
A29
NA
GND
AH28
NA
GND
V28
NA
GND
N28
NA
GND
C28
NA
GND
AG27
NA
GND
D27
NA
GND
AF26
NA
GND
E26
NA
GND
F25
NA
GND
AE25
NA
GND
G24
NA
GND
AJ23
NA
GND
AD24
Table 5:
FG900 Fine-Pitch BGA Package — XCV812E
Bank
Description
Pin
NA
GND
H23
NA
GND
B23
NA
GND
AC23
NA
GND
AB22
NA
GND
V22
NA
GND
N22
NA
GND
AH18
NA
GND
AB18
NA
GND
J18
NA
GND
C18
NA
GND
U17
NA
GND
T17
NA
GND
R17
NA
GND
P17
NA
GND
U16
NA
GND
T16
NA
GND
R16
NA
GND
P16
NA
GND
U15
NA
GND
T15
NA
GND
R15
NA
GND
P15
NA
GND
U14
NA
GND
T14
NA
GND
R14
NA
GND
P14
NA
GND
AH13
NA
GND
AB13
NA
GND
J13
NA
GND
C13
NA
GND
V9
NA
GND
N9
NA
GND
J9
NA
GND
AJ8
Table 5:
FG900 Fine-Pitch BGA Package — XCV812E
Bank
Description
Pin
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