- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄62764 > WEDPS512K32-35BC (MICROSEMI CORP-PMG MICROELECTRONICS) 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PBGA143 PDF資料下載
參數(shù)資料
| 型號(hào)： | WEDPS512K32-35BC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁(yè)數(shù)： | 6/6頁(yè) |
| 文件大?。?/td> | 202K |
| 代理商： | WEDPS512K32-35BC |
6
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
WEDPS512K32-XBX
ORDERING INFORMATION
DEVICE GRADE:
M= MILITARY SCREENED
-55°C TO +125°C
I= INDUSTRIAL
-40°C TO 85°C
C= COMMERCIAL
0°C TO +70°C
PACKAGE TYPE:
B = 143 PBGA, 16mm x 18mm, 288mm2
ACCESS TIME (ns)
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
PLASTIC
WHITE ELECTRONIC DESIGNS CORP.
WED P S 512K 32 - XX X X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WEDPS512K32V-20BI | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PBGA143 |
| WEM1010-1003 | 50 MHz - 300 MHz RF/MICROWAVE SPLITTER, 1.5 dB INSERTION LOSS |
| WF-128K32-150HI | 512K X 8 FLASH 12V PROM MODULE, 150 ns, CPGA66 |
| WF-128K32-150HM | 512K X 8 FLASH 12V PROM MODULE, 150 ns, CPGA66 |
| WF1024K32-100G2Q | 4M X 8 FLASH 12V PROM MODULE, 100 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPS512K32LV-12BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-15BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-15BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。