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參數(shù)資料
| 型號： | WEDPS512K32-35BC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 202K |
| 代理商： | WEDPS512K32-35BC |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDPS512K32-XBX
512Kx32 SRAM MULTI-CHIP PACKAGE
n Access Times of 12, 15, 17, 20, ns
n Packaging
16mm x 18mm, 143 PBGA
n Organized as 512Kx32, User Configurable as 1Mx16 or
2Mx8
FIG. 1
PIN CONFIGURATION FOR WEDPS512K32-XBX
May 2002 Rev. 3
FEATURES
*This data sheet describles a product that is developmental, is not qualified and
is subject to change or cancellation without notice.
TOP VIEW
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
n Commercial, Industrial and Military Temperature Ranges
n TTL Compatible Inputs and Outputs
n 5 Volt Power Supply
n Low Power CMOS
BLOCK DIAGRAM
ADVANCED*
12
34
5
6
7
8
9
10
11
12
A
-
A2
A1
A0
GND
V CC
A18
A17
A16
GND
B
CS2
A 3
A 4
D14
D15
NC
CS4
D24
D25
O E
A15
N C
C
D 9
D 8
NC
D12
D13
GND
V CC
D26
D27
WE4
D31
D30
D
D10
D11
GND
V CC
D28
D29
E
WE2
GND
V CC
NC
F
GND
V CC
G
V CC
GND
H
CS1
V CC
GND
N C
J
D1
D0
V CC
GND
D23
D22
K
D2
D3
N C
D7
D5
V CC
GND
D17
D16
CS3
D20
D21
L
WE1
A 6
A 5
D 6
D 4
N C
WE3
D19
D18
A14
A13
NC
M
GND
A 7
A 8
A 9
V CC
GND
A10
A11
A12
V CC
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