參數(shù)資料
型號(hào)： WC32P020-XXM
英文描述： 16 32-Bit General-Purpose Data and Address Registers
中文描述： 16 32位通用數(shù)據(jù)和地址寄存器
文件頁(yè)數(shù)： 6/14頁(yè)
文件大?。?/td> 488K
代理商： WC32P020-XXM
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WC32P020-XXM
December 2002
Rev. 2
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
POWER CONSIDERATIONS
The average chip junction temperature, TJ, in °C can be
obtained from:
T
J
= T
A
+ (P
D
θ
JA
)
where:
T
A
= Ambient Temperature, °C
q
JA
= Package Thermal Resistance, Junction-to-
Ambient, °C/W
P
D
= PINT+PI/O
P
INT
= I
CC
x V
CC
, Watts-Chip Internal Power
P
I/O
= Power Dissipation on Input and Output
Pins-User Determined
For most applications, P
I/O
< P
lNT
and can be neglected.
The following is an approximate relationship between P
D
and T
J
(if P
I/O
is neglected ):
P
D
= KT(T
J
+ 273°C)
(1)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
(T
A
+ 273°C) + q
JA
P
D2
where K is a constant pertaining to the particular part. K
can be determined from equation (3) by measuring P
D
(at equilibrium) for a known TA. Using this value of K, the
values of P
D
and T
J
can be obtained by solving equations
(1) and (2) iteratively for any value of T
A
.
The total thermal resistance of a package (θ
JA
) can be
separated into two components, θ
JC
and θ
CA
, representing
the barrier to heat flow from the semiconductor junction
to the package (case) surface (θ
JC
) and from the case to
the outside ambient (q
CA
). These terms are related by the
equation:
θ
JA
= θ
JC
+ θ
CA
(3)
(4)
MAXIMUM RATINGS
Symbol
V
CC
V
I
P
DMAX
T
CASE
T
CASE
T
STG
T
J
Parameter
Supply voltage
Input voltage
Max Power dissipation
Operating temperature (Mil.)
Operating temperature (Ind.)
Storage temperature
Junction temperature
Min
-0.3
-0.3
Max
+7.0
+7.0
2.0
+125
+85
+150
+160
Unit
V
V
W
°C
°C
°C
°C
-55
-40
-55
Thermal Characteristics
(with no heat sink or airflow)
Characteristic
Thermal Resistance — Junction to Ambient
PGA Package
CQFP Package
Thermal Resistance — Junction to Case
PGA Package
CQFP Package
Symbol
θ
JA
Value
Rating
°C/W
26
46
θ
JC
3
15
°C/W
θ
JC
is device related and cannot be influenced by the user.
However, θ
CA
is user dependent and can be minimized
by such thermal management techniques as heat sinks,
ambient air cooling, and thermal convection. Thus,
good thermal management on the part of the user can
significantly reduce θ
CA
so that θ
JA
approximately equals
θ
JC
. Substitution of θ
JC
for θ
JA
in equation (1) will result in
a lower semiconductor junction temperature.
相關(guān)PDF資料
PDF描述
WC32P040-XXM 32-Bit, Nonmultiplexed External Address and Data Buses with Synchronous Interface
WC701 RF Chip Inductor
WC701_1 RF Chip Inductor Catalog - Design Kits. Selection Guide. Perfomance Specs (12/02) - pages 1-5 (5 pages)
WC701_2 RF Chip Inductor Catalog - Series: 0402CD. 0603CD. 0805CD. 0805CM. 0805FT (12/02) - pages 6-15 (10 pages)
WC701_3 WIRE-WOUND RF CHIP INDUCTORS
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