參數(shù)資料
型號(hào)： W3H32M64EA-667SBC
廠商： MICROSEMI CORP-PMG MICROELECTRONICS
元件分類： DRAM
英文描述： 32M X 64 DDR DRAM, PBGA208
封裝： 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁(yè)數(shù)： 26/28頁(yè)
文件大?。?/td> 1057K
代理商： W3H32M64EA-667SBC
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2010 2010 White Electronic Designs Corp. All rights reserved
Rev. 0
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specications without notice.
W3H32M64EA-XSBX
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2010 2010 White Electronic Designs Corp. All rights reserved
Rev. 0
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specications without notice.
W3H32M64EA-XSBX
tVTD 1
CKE
Rtt
Power-up:
V dd and stable
clock (CK, CK#)
T = 200s (MIN) 3
High-Z
DM
15
DQS
15
High-Z
Address
16
CK
CK#
tCL
V tt 1
V ref
V CC Q
Command
NOP 3
PRE
T0
Ta0
Don’t care
tCL
tCK
V CC
ODT
DQ
15
High-Z
Tb0
200 cycles of CK are required before a READ command can be issued
MR with
DLL RESET
tRFC
LM 8
PRE 9
LM 7
REF 10
LM 11
Tg0
Th0
Ti0
Tj0
MR without
DLL RESET
EMR with
OCD default
Tk0
Tl0
Tm0
Te0
Tf0
EMR(2)
EMR(3)
tMRD
LM 6
LM 5
A10 = 1
tRPA
Tc0
Td0
SSTL_18
low level
2
Valid 14
Valid
Indicates a Break in
Time Scale
LM 12
EMR with
OCD exit
LM 13
Normal
operation
See no te 10
Code
A10 = 1
Code
tMRD
tRPA
tRFC
V CC L
tMRD
EMR
T = 400ns (MIN) 4
LVCMOS
low level 2
FIGURE 4 – POWER-UP AND INITIALIZATION
Notes appear on page 7
相關(guān)PDF資料
PDF描述
W3H32M72E-667SB2M 32M X 72 DDR DRAM, 0.65 ns, PBGA208
W3H32M72E-667SBC 32M X 72 DDR DRAM, 0.65 ns, PBGA208
W3H64M16E-400BC 64M X 16 DDR DRAM, 0.6 ns, PBGA79
W3H64M64E-400SBC 64M X 64 DDR DRAM, 0.6 ns, PBGA208
W3H64M72E-400ESI 64M X 72 DDR DRAM, 0.6 ns, PBGA208
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H32M64E-ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SB 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
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