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參數(shù)資料
| 型號： | W25X32-VSSI-Z |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 32M X 1 FLASH 2.7V PROM, PDSO8 |
| 封裝： | 0.208 INCH, ROHS COMPLIANT, SOIC-8 |
| 文件頁數(shù)： | 41/47頁 |
| 文件大小： | 1317K |
| 代理商： | W25X32-VSSI-Z |
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W25X16, W25X32, W25X64
- 46 -
15.
REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
02/13/06
New Create
B
06/28/06
1-4, 6, 32-36,
41, 42
Added W25X64 in the product family of
W25X16/32/64.
Added 300mil PDIP package.
Added 6x5 mm WSON package.
Updated Endurance and Data Retention
table (11.3), ICC’s in DC Parameter table
(11.5 & 11.6).
Reduced tPP (max) from 5mS to 3mS.
Changed tSHCH from 5nS to 0nS.
Added byte programming parameters (tBP1
& tBPn.
Added additional byte programming
parameter, tBP2 and moved multiple byte
programming tBPn with formula to foot note.
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and spiFlash are trademarks of Winbond
Electronics Corporation All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25X32VZEI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X32VZEIG | 功能描述:IC FLASH 32MBIT 75MHZ 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2 |
| W25X32VZEIG T&R | 功能描述:IC FLASH 32MBIT 75MHZ 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2 |
| W25X32VZEIZ | 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X32VZPI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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