參數(shù)資料
型號： W25Q80VZPI
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 1M X 8 SPI BUS SERIAL EEPROM, DSO8
封裝： 6 X 5 MM, WSON-8
文件頁數(shù)： 12/60頁
文件大?。?/td> 1276K
代理商： W25Q80VZPI
W25Q80, W25Q16, W25Q32
- 2 -
Table of Contents
1.
GENERAL DESCRIPTION ......................................................................................................... 5
2.
FEATURES ................................................................................................................................. 5
3.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 6
4.
PIN CONFIGURATION WSON 6X5-MM .................................................................................... 6
5.
PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM........................................................ 6
6.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
7.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
7.1
Package Types ............................................................................................................... 8
7.2
Chip Select (/CS) ............................................................................................................ 8
7.3
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8
7.4
Write Protect (/WP)......................................................................................................... 8
7.5
HOLD (/HOLD) ............................................................................................................... 8
7.6
Serial Clock (CLK) .......................................................................................................... 8
8.
BLOCK DIAGRAM ...................................................................................................................... 9
9.
FUNCTIONAL DESCRIPTION ................................................................................................. 10
9.1
SPI OPERATIONS ....................................................................................................... 10
9.1.1
Standard SPI Instructions...............................................................................................10
9.1.2
Dual SPI Instructions ......................................................................................................10
9.1.3
Quad SPI Instructions.....................................................................................................10
9.1.4
Hold Function .................................................................................................................10
9.2
WRITE PROTECTION.................................................................................................. 11
9.2.1
Write Protect Features....................................................................................................11
10.
CONTROL AND STATUS REGISTERS................................................................................... 12
10.1
STATUS REGISTER .................................................................................................... 12
10.1.1
BUSY............................................................................................................................12
10.1.2
Write Enable Latch (WEL) ............................................................................................12
10.1.3
Block Protect Bits (BP2, BP1, BP0)..............................................................................12
10.1.4
Top/Bottom Block Protect (TB).....................................................................................12
10.1.5
Sector/Block Protect (SEC) ..........................................................................................12
10.1.6
Status Register Protect (SRP1, SRP0).........................................................................13
10.1.7
Quad Enable (QE) ........................................................................................................13
10.1.8
Status Register Memory Protection ..............................................................................15
10.2
INSTRUCTIONS ........................................................................................................... 18
10.2.1
Manufacturer and Device Identification ........................................................................18
10.2.2
Instruction Set Table 1..................................................................................................19
10.2.3
Instruction Set Table 2 (Read Instructions) ..................................................................20
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