參數(shù)資料
型號: W25Q128BVEIP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 128M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 8 X 6 MM, GREEN, WSON-8
文件頁數(shù): 24/74頁
文件大小: 855K
代理商: W25Q128BVEIP
W25Q128BV
- 30 -
7.2.14 Fast Read Dual I/O (BBh)
The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO
pins, IO0 and IO1. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to input
the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code
execution (XIP) directly from the Dual SPI in some applications.
Fast Read Dual I/O with “Continuous Read Mode”
The Fast Read Dual I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in Figure 13a. The
upper nibble of the (M7-4) controls the length of the next Fast Read Dual I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Dual I/O instruction (after /CS is
raised and then lowered) does not require the BBh instruction code, as shown in Figure 13b. This reduces
the instruction sequence by eight clocks and allows the Read address to be immediately entered after /CS
is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next instruction (after
/CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation.
A “Continuous Read Mode” Reset instruction can also be used to reset (M7-0) before issuing normal
instructions (See 7.2.20 for detail descriptions).
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (BBh)
8
9
10
12
13
14
24
25
26
27
28
29
30
31
6
4
2
0
*
23
/CS
CLK
DI
(IO
0)
DO
(IO
1)
0
32
33
34
35
36
37
38
39
7
5
3
1
*
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
**
IOs switch from
Input to Output
6
7
22
20
18
16
23
21
19
17
14
12
10
8
15
13
11
9
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
11
15
16
17
18
20
21
22
19
23
1
A23-16
A15-8
A7-0
M7-0
Byte 1
Byte 2
Byte 3
Byte 4
= MSB
*
Figure 13a. Fast Read Dual I/O Instruction Sequence (Initial instruction or previous M5-4
≠ 10)
相關(guān)PDF資料
PDF描述
W25Q128BVFIP 128M X 1 SPI BUS SERIAL EEPROM, PDSO16
W25Q16CLSFIP 16M X 1 SPI BUS SERIAL EEPROM, PDSO16
W25Q16CLDAIG 16M X 1 SPI BUS SERIAL EEPROM, PDIP8
W25Q16CLZPIP 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q16CLSFIG 16M X 1 SPI BUS SERIAL EEPROM, PDSO16
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q128BVFIG 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3.3V 128Mbit 16M x 8bit 8.5ns 16-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:128MB SPI FLASH
W25Q128BVFIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q128FV 制造商:WINBOND 制造商全稱:Winbond 功能描述:SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q128FVAIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q128FVAIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI