參數(shù)資料
型號(hào): V63C31364097
廠商: Mosel Vitelic, Corp.
英文描述: 128K X 36 CMOS Synchronous Burst Flow-Through SRAM(128Kx36CMOS同步脈沖流經(jīng)過的SRAM)
中文描述: 128K的米鼠36的CMOS同步突發(fā)流量通過的SRAM(128Kx36CMOS同步脈沖流經(jīng)過的靜態(tài)存儲(chǔ)器)
文件頁數(shù): 6/14頁
文件大?。?/td> 73K
代理商: V63C31364097
6
V63C31364097 Rev. 0.4 February 1999
MOSEL V ITELIC
V63C31364097
Package Thermal Characteristics (See Note 1)
Notes:
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, board population, and board thermal resistance
2.
Per SEMI G38-87
3.
Indicates the average thermal resistance between the die and the printed circuit board
4.
Indicates the average thermal resistance between the die and the case top surface via the cold plate method
(MIL- SPEC-883 Method 1012.1).
Recommended Operating Conditions (Voltages referenced to V
SS
= 0V)
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (@ 200 ifm)
Single Layer Board
Four Layer Board
R
q
JA
40
25
°
C/W
2
Junction to Board (Bottom)
R
q
JB
17
°
C/W
3
Junction to Case (Top)
R
q
JB
9
°
C/W
4
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
V
DD
3.135
3.3
3.6
V
Operating Temperature
T
J
20
110
°
C
Input Low Voltage
V
IL
– 0.3
0.7
V
Input High Voltage
V
IH
1.7
V
DD
+ 0.3
V
I/O Supply Voltage
V
DDQ
2.375
2.5
V
DD
V
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