參數(shù)資料
型號： UPD789132GS-XXX
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, MICROCONTROLLER, PDSO30
封裝： 0.300 INCH, SHRINK, PLASTIC, SOP-30
文件頁數(shù)： 41/54頁
文件大小： 481K
代理商： UPD789132GS-XXX
Data Sheet U13025EJ2V0DS00
44
PD789121, 789122, 789124, 789131, 789132, 789134
13. RECOMMENDED SOLDERING CONDITIONS
The
PD789121, 789122, 789124, 789131, 789132, and 789134 should be soldered and mounted under the
following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended
below, contact your NEC sales representative.
Table 13-1. Surface Mounting Type Soldering Conditions (1/2)
PD789121GS-xxx: 30-pin plastic shrink SOP (300 mils, resin thickness 1.7 mm)
PD789122GS-xxx: 30-pin plastic shrink SOP (300 mils, resin thickness 1.7 mm)
PD789124GS-xxx: 30-pin plastic shrink SOP (300 mils, resin thickness 1.7 mm)
PD789131GS-xxx: 30-pin plastic shrink SOP (300 mils, resin thickness 1.7 mm)
PD789132GS-xxx: 30-pin plastic shrink SOP (300 mils, resin thickness 1.7 mm)
PD789134GS-xxx: 30-pin plastic shrink SOP (300 mils, resin thickness 1.7 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),
Count: twice or less, Exposure limit: 7 days
Note (after that, prebake at 125°C for 20
hours)
IR35-207-2
VPS
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),
Count: twice or less, Exposure limit: 7 days
Note (after that, prebake at 125°C for 20
hours)
VP15-207-2
Wave soldering
Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,
Preheating temperature: 120°C Max. (package surface temperature), Exposure
limit: 7 days
Note (after that, prebake at 125°C for 20 hours)
WS60-207-1
Partial heating
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
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