參數(shù)資料
型號(hào)： UPD75P3018AGK-9EU
廠商： NEC Corp.
元件分類： 圓形連接器
英文描述： Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No
中文描述： 4位單片機(jī)
文件頁(yè)數(shù)： 49/64頁(yè)
文件大?。?/td> 356K
代理商： UPD75P3018AGK-9EU
PD75P3018A
53
Data Sheet U11917EJ2V0DS00
Table 11-1. Soldering Conditions of Surface Mount Type (2/2)
(3)
PD75P3018AGK-BE9: 80-pin plastic TQFP (fine pitch) (12 × 12 mm, resin thickness 1.05 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°C, Reflow time: 30 seconds or below (210°C
IR35-107-3
or higher), Number of reflow processes: 3 max., Exposure limit: 7 daysNote
(After that, prebaking is necessary at 125
°C for 10 hours)
VPS
Package peak temperature: 215
°C, Reflow time: 40 seconds or below (200°C
VP15-107-3
or higher), Number of reflow processes: 3 max., Exposure limit: 7 daysNote
(After that, prebaking is necessary at 125
°C for 10 hours)
Partial heating
Pin temperature: 300
°C or below, Time: 3 seconds or below (per side of device)
—
Note The number of days for storage after the dry pack has been opened. The storage conditions are 25
°C, 65% RH max.
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
(4)
PD75P3018AGK-9EU: 80-pin plastic TQFP (fine pitch) (12 × 12 mm, resin thickness 1.00 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°C, Reflow time: 30 seconds or below (210°C
IR35-107-2
or higher), Number of reflow processes: 2 max., Exposure limit: 7 daysNote
(After that, prebaking is necessary at 125
°C for 10 hours)
VPS
Package peak temperature: 215
°C, Reflow time: 40 seconds or below (200°C
VP15-107-2
or higher), Number of reflow processes: 2 max., Exposure limit: 7 daysNote
(After that, prebaking is necessary at 125
°C for 10 hours)
Partial heating
Pin temperature: 300
°C or below, Time: 3 seconds or below (per side of device)
—
Note The number of days for storage after the dry pack has been opened. The storage conditions are 25
°C, 65% RH max.
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
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