參數(shù)資料
型號： UPD703100AF1-33-FA1
廠商： NEC Corp.
英文描述： V850E/MS1TM 32/16-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述： V850E/MS1TM 32/16單晶片微控制器
文件頁數(shù)： 128/132頁
文件大小： 1174K
代理商： UPD703100AF1-33-FA1
Preliminary Data Sheet U14168EJ2V0DS00
128
μ
PD703100A-33, 703100A-40, 703101A-33, 703102A-33
18. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 18-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD703100AF1-33-FA1:
μ
PD703100AF1-40-FA1:
μ
PD703101AF1-33-
×××
μ
PD703102AF1-33-
157-pin plastic FBGA (14
×
14 mm)
157- pin plastic FBGA (14
×
14 mm)
157- pin plastic FBGA (14
×
14 mm)
157- pin plastic FBGA (14
×
14 mm)
-FA1:
×××
-FA1:
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 230
°
C, Time: 30 sec. Max. (At 210
°
C or higher), Count:
two times or less, Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (Per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
(2)
μ
PD703100AGJ-33-8EU:
μ
PD703100AGJ-40-8EU:
μ
PD703101AGJ-33-
μ
PD703102AGJ-33-
144-pin plastic LQFP (fine pitch) (20
×
20 mm)
144-pin plastic LQFP (fine pitch) (20
×
20 mm)
-8EU: 144-pin plastic LQFP (fine pitch) (20
×
20 mm)
×××
-8EU: 144-pin plastic LQFP (fine pitch) (20
×
20 mm)
×××
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher), Count:
two times or less, Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD703100AF1-40-FA1 制造商:NEC 制造商全稱:NEC 功能描述:V850E/MS1TM 32/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD703100AGJ-33-8EU 制造商:NEC 制造商全稱:NEC 功能描述:V850E/MS1TM 32/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD703100AGJ-33-UEN-A 制造商:Renesas Electronics Corporation 功能描述: 制造商:Renesas Electronics Corporation 功能描述:MCU 32-bit V850E1 RISC ROMLess 3.3V 144-Pin LQFP
UPD703100AGJ-40-8EU 制造商:NEC 制造商全稱:NEC 功能描述:V850E/MS1TM 32/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD703100GJ-33-8EU 制造商:NEC 制造商全稱:NEC 功能描述:V850E/MS1TM 32/16-BIT SINGLE-CHIP MICROCONTROLLERS
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