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參數(shù)資料
| 型號： | UDA1342 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | Codec |
| 英文描述： | Audio CODEC |
| 中文描述： | 音頻編解碼器 |
| 文件頁數(shù)： | 40/44頁 |
| 文件大?。?/td> | 180K |
| 代理商： | UDA1342 |
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2000 Mar 29
40
Philips Semiconductors
Preliminary specification
Audio CODEC
UDA1342TS
19.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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PDF描述 |
|---|---|
| UDA1344 | Low-voltage low-power stereo audio CODEC with DSP features |
| UDA1345 | Economy audio CODEC |
| UDA1350AH | IEC 958 audio DAC(IEC 958音頻轉(zhuǎn)換器) |
| UDA1350ATS | IEC 958 audio DAC |
| UDA1351 | 96 kHz IEC 958 audio DAC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UDA1342TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Audio CODEC |
| UDA1342TS/N1 | 制造商:NXP Semiconductors 功能描述:IC CODEC AUDIO MINIDISC 28-SSOP 制造商:NXP Semiconductors 功能描述:IC, CODEC, AUDIO, MINIDISC, 28-SSOP 制造商:NXP Semiconductors 功能描述:IC, CODEC, AUDIO, MINIDISC, 28-SSOP; Audio CODEC Type:Stereo Codec; No. of ADCs:4; No. of DACs:2; No. of Input Channels:4; No. of Output Channels:2; Audio IC Case Style:SSOP; No. of Pins:28; ADC / DAC Resolution:24bit; ADCs / DACs ;RoHS Compliant: Yes |
| UDA1342TS/N1,512 | 功能描述:接口—CODEC AUDIO CODEC MINIDISC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UDA1342TS/N1,518 | 功能描述:接口—CODEC MINISOUND 3 RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UDA1342TSDB | 功能描述:接口—CODEC AUDIO CODEC MINIDISC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
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