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| 型號(hào)： | TWR-MCF51MM-KIT |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 9/57頁 |
| 文件大?。?/td> | 0K |
| 描述： | KIT TOWER DEV FOR MCF51AG |
| 設(shè)計(jì)資源： | TWR-MCF51MM Schematic |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | ColdFire®, Flexis™ |
| 類型： | MCU |
| 適用于相關(guān)產(chǎn)品： | Freescale 電源塔系統(tǒng)，MCF51MM |
| 所含物品： | 4 個(gè)板，線纜，文檔，DVD，MED-EKG 傳感器 |
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Electrical Characteristics
Freescale Semiconductor
17
3.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1TA
Operating temperature range (packaged):
C
MCF51MM256
–40 to 105
MCF51MM128
–40 to 105
2TJMAX
Maximum junction temperature
135
C
3
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on theboard, and board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s — Single layer board, one signal layer
4 2s2p — Four layer board, 2 signal and 2 power layers
C/W
104-pin MBGA
67
100-pin LQFP
53
81-pin MBGA
67
80-pin LQFP
53
4
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
C/W
104-pin MBGA
39
100-pin LQFP
41
81-pin MBGA
39
80-pin LQFP
39
MCF51MM256/128, Rev. 5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| TWR-MCF51QM | 功能描述:開發(fā)板和工具包 - COLDFIRE MCF51JF Tower Module RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Kits 工具用于評(píng)估:MCF53017 核心:ColdFire V3 接口類型:Ethernet, UART, USB 工作電源電壓:12 V |
| TWR-MCF51QM-KIT | 功能描述:開發(fā)板和工具包 - COLDFIRE MCF51QM Tower Kit RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Kits 工具用于評(píng)估:MCF53017 核心:ColdFire V3 接口類型:Ethernet, UART, USB 工作電源電壓:12 V |
| TWR-MCF5225X | 功能描述:開發(fā)板和工具包 - COLDFIRE Kirin3 MCU Story Board RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Kits 工具用于評(píng)估:MCF53017 核心:ColdFire V3 接口類型:Ethernet, UART, USB 工作電源電壓:12 V |
| TWR-MCF5225X | 制造商:Freescale Semiconductor 功能描述:Tower System 32-bit MCF52 V2 M |
| TWR-MCF5225X-KIT | 功能描述:開發(fā)板和工具包 - COLDFIRE Kirin3 Tower Kit RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Kits 工具用于評(píng)估:MCF53017 核心:ColdFire V3 接口類型:Ethernet, UART, USB 工作電源電壓:12 V |
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