參數(shù)資料
型號: TWR-MCF51MM-KIT
廠商: Freescale Semiconductor
文件頁數(shù): 51/57頁
文件大?。?/td> 0K
描述: KIT TOWER DEV FOR MCF51AG
設(shè)計資源: TWR-MCF51MM Schematic
標準包裝: 1
系列: ColdFire®, Flexis™
類型: MCU
適用于相關(guān)產(chǎn)品: Freescale 電源塔系統(tǒng),MCF51MM
所含物品: 4 個板,線纜,文檔,DVD,MED-EKG 傳感器
Ordering Information
Freescale Semiconductor
53
4
Ordering Information
This section contains ordering information for the device numbering system. See Table 1 for feature
summary by package information.
4.1
Part Numbers
4.2
Package Information
4.3
Mechanical Drawings
Table 31 provides the available package types and their document numbers. The latest package
outline/mechanical drawings are available on the MCF51MM256/128 Product Summary pages at
To view the latest drawing, either:
Click on the appropriate link in Table 31, or
Open a browser to the Freescale website (http://www.freescale.com), and enter the appropriate
document number (from Table 31) in the “Enter Keyword” search box at the top of the page.
.
Table 30. Orderable Part Number Summary
Freescale Part
Number
Description
Flash / SRAM
(Kbytes)
Package
Temperature
MCF51MM256VML
MCF51MM256 ColdFire Microcontroller
256K/32K
104 MAPBGA
–40 to 105
°C
MCF51MM256VLL
MCF51MM256 ColdFire Microcontroller
256K/32K
100 LQFP
–40 to 105
°C
MCF51MM256VMB
MCF51MM256 ColdFire Microcontroller
256K/32K
81 MAPBGA
–40 to 105
°C
MCF51MM256VLK
MCF51MM256 ColdFire Microcontroller
256K/32K
80 LQFP
–40 to 105
°C
MCF51MM128VMB
MCF51MM128 ColdFire Microcontroller
128K/32K
81 MAPBGA
–40 to 105
°C
MCF51MM128VLK
MCF51MM128 ColdFire Microcontroller
128K/32K
80 LQFP
–40 to 105
°C
Table 31. Package Descriptions
Pin Count
Package Type
Abbreviation
Designator
Case No.
Document No.
100
Low Quad Flat Package
LQFP
LL
983-03
80
Low Quad Flat Package
LQFP
LK
1418
104
MAP BGA Package
MAPBGA
ML
1285-02
81
MAP BGA Package
MAPBGA
MB
1662-01
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