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參數(shù)資料
| 型號： | TSL2569T |
| 廠商： | AMS-TAOS USA Inc |
| 文件頁數(shù)： | 35/37頁 |
| 文件大?。?/td> | 785K |
| 描述： | IC LIGHT TO DGTL CONV 6-TMB |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
| 其它名稱： | TSL2569-TDKR |
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TSL2568, TSL2569
LIGHT-TO-DIGITAL CONVERTER
TAOS091D DECEMBER 2008
34
r
r
Copyright E 2008, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the
package molding compound contains the smallest amount of absorbed moisture possible, each device is
dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica
gel to protect them from ambient moisture during shipping, handling, and storage before use.
The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under
the following conditions:
Temperature Range
5癈 to 50癈
Relative Humidity
60% maximum
Floor Life
1 year out of bag at ambient < 30癈 / 60% RH
Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,
it should be done at 90癈 for 3 hours.
The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under
the following conditions:
Temperature Range
5癈 to 50癈
Relative Humidity
60% maximum
Total Time
6 months from the date code on the aluminized envelope if unopened
Opened Time
168 hours or fewer
Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90癈 for 4 hours.
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