參數(shù)資料
型號(hào)： TSL2569T
廠商： AMS-TAOS USA Inc
文件頁(yè)數(shù)： 33/37頁(yè)
文件大小： 785K
描述： IC LIGHT TO DGTL CONV 6-TMB
標(biāo)準(zhǔn)包裝： 1
系列： *
其它名稱： TSL2569-TDKR
TSL2568, TSL2569
LIGHT-TO-DIGITAL CONVERTER
TAOS091D  DECEMBER 2008
32
r
r
Copyright E 2008, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
The CS and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. TSL2568/69 Solder Reflow Profile
PARAMETER
REFERENCE
TSL2568/69
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above 217癈
t
1
Max 60 sec
Time above 230癈
t
2
Max 50 sec
Time above T
peak
 10?/SPAN>C
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260?C (0癈/+5癈)
Temperature gradient in cooling
Max 5癈/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale  for reference only
Time (sec)
Figure 23. TSL2568/TSL2569 Solder Reflow Profile Graph
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