參數(shù)資料
型號(hào): TPS65013RGZ
廠商: Texas Instruments, Inc.
英文描述: POWER AND BATTERY MANAGEMENT IC FOR Li-ION POWERED SYSTEMS
中文描述: 電源和電池管理集成電路鋰離子供電系統(tǒng)
文件頁(yè)數(shù): 2/52頁(yè)
文件大?。?/td> 844K
代理商: TPS65013RGZ
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
PACKAGE DISSIPATION RATINGS
(1)
TPS65013
SLVS517–AUGUST 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The serial interface can be used for dynamic voltage scaling, for collecting information on and controlling the
battery charger status, for optionally controlling 2 LED driver outputs, a vibrator driver, masking interrupts, or for
disabling/enabling and setting the LDO output voltages. The interface is compatible with the fast/standard mode
I
2
C specification allowing transfers at up to 400 kHz.
ORDERING INFORMATION
T
A
PACKAGE
PART NUMBER
(1)
TPS65013RGZ
-40
°
C to 85
°
C
7 mm
×
7 mm, 48-pin QFN
(1)
The RGZ package is available in tape and reel. Add R suffix (TPS65013RGZR) to order quantities of
2500 parts per reel. Add T suffix (TPS65013RGZT) to order quantities of 250 parts per reel.
UNIT
20 V
Input voltage on VAC pin with respect to AGND
Input voltage range on all other pins except AGND/PGND pins with respect to AGND
HBM and CDM capabilities at pins VIB, PG, and LED2
Current at AC, VBAT, VINMAIN, L1, PGND1
Peak current at all other pins
Continuous power dissipation
Operating free-air temperature, T
A
Maximum junction temperature, T
J
Storage temperature, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
-0.3 V to 7 V
1 kV
1800 mA
1000 mA
See Dissipation Rating Table
-40
°
C to 85
°
C
125
°
C
-65
°
C to 150
°
C
260
°
C
(1)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AMBIENT
TEMPERATURE
25
°
C
55
°
C
MAX POWER DISSIPATION
FOR T
j
= 125
°
C
(2)
3 W
2.1 W
DERATING FACTOR
ABOVE T
A
= 55
°
C
30 mW/
°
C
(1)
The TPS65013 is housed in a 48-pin QFN package with exposed leadframe on the underside. This 7
mm
×
7 mm package exhibits a thermal impedance (junction-to-ambient) of 33 K/W when mounted
on a JEDEC high-k board.
Consideration needs to be given to the maximum charge current when the assembled application
board exhibits a thermal impedance which differs significantly from the JEDEC high-k board.
(2)
2
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