參數(shù)資料
型號: TMX320F28069UPZPA
廠商: Texas Instruments
文件頁數(shù): 128/174頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 128KB FLSH 100HTQFP
產(chǎn)品培訓(xùn)模塊: ControlSUITE
Piccolo F2806x
TPS75005 Single IC Power for C2000 MCU
標準包裝: 1
系列: TMS320F2806x, Piccolo™, C2000™
核心處理器: C28x
芯體尺寸: 32-位
速度: 80MHz
連通性: CAN,I²C,McBSP,SCI,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 54
程序存儲器容量: 256KB(128K x 16)
程序存儲器類型: 閃存
RAM 容量: 50K x 16
電壓 - 電源 (Vcc/Vdd): 1.71 V ~ 1.995 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-TQFP 裸露焊盤
包裝: 托盤
其它名稱: 296-30086
TMX320F28069UPZPA-ND
PREFIX
TMS
TMX = experimental device
TMP = prototype device
TMS = qualified device
320
DEVICE FAMILY
320 = TMS320 MCU Family
F
TECHNOLOGY
F = Flash
28069
DEVICE
(B)
28069
28068
28067
28066
28065
28064
28063
28062
28069U
28068U
28067U
28066U
28065U
28064U
28063U
28062U
PZP
PACKAGE TYPE
80-Pin PN Low-Profile Quad Flatpack (LQFP)
10
80-Pin PFP PowerPAD
Thermally Enhanced Thin Quad Flatpack (HTQFP)
0-Pin PZ Low-Profile Quad Flatpack (LQFP)
100-Pin PZP PowerPAD
Thermally Enhanced Thin Quad Flatpack (HTQFP)
TM
TEMPERATURE RANGE
(A)
S
40°C to 105°C
40°C to 125°C
(Q refers to Q100 qualification for automotive applications.)
T
S
Q
=
SPRS698D – NOVEMBER 2010 – REVISED DECEMBER 2012
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, S). Figure 3-1 provides a legend
for reading the complete device name for any family member.
A.
The "Q" temperature option is not available on the 2806xU devices.
B.
USB is available only on 2806xU devices.
Figure 3-1. Device Nomenclature
Copyright 2010–2012, Texas Instruments Incorporated
Device and Documentation Support
57
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