- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄365844 > TMP95PW64F (Toshiba Corporation) Quality And Reliability Assurance / Handling Precautions PDF資料下載
參數(shù)資料
| 型號(hào)： | TMP95PW64F |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 45/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP95PW64F |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁當(dāng)前第45頁第46頁第47頁第48頁
Quality and Reliability Assurance / Handling Precautions
030901
QUA-45
2002-02-20
4.5.5 Circuit Board Coating
When devices are to be used in equipment requiring a high degree of reliability
or in extreme environments (where moisture, corrosive gas or dust is present),
circuit boards may be coated for protection. However, before doing so, you
must carefully consider the possible stress and contamination effects that may
result and then choose the coating resin which results in the minimum level of
stress to the device.
4.6
Protecting Devices in the Field
4.6.1 Temperature
Semiconductor devices are generally more sensitive to temperature than are
other electronic components. The various electrical characteristics of a
semiconductor device are dependent on the ambient temperature at which the
device is used. It is therefore necessary to understand the temperature
characteristics of a device and to incorporate device derating into circuit
design. Note also that if a device is used above its maximum temperature
rating, device deterioration is more rapid and it will reach the end of its usable
life sooner than expected.
4.6.2 Humidity
Resin-molded devices are sometimes improperly sealed. When these devices
are used for an extended period of time in a high-humidity environment,
moisture can penetrate into the device and cause chip degradation or
malfunction. Furthermore, when devices are mounted on a regular printed
circuit board, the impedance between wiring components can decrease under
high-humidity conditions. In systems which require a high signal-source
impedance, circuit board leakage or leakage between device lead pins can
cause malfunctions. The application of a moisture-proof treatment to the
device surface should be considered in this case. On the other hand, operation
under low-humidity conditions can damage a device due to the occurrence of
electrostatic discharge. Unless damp-proofing measures have been specifically
taken, use devices only in environments with appropriate ambient moisture
levels (i.e. within a relative humidity range of 40% to 60%).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TMP96C041BF | Quality And Reliability Assurance / Handling Precautions |
| TMP95FW54AF | Quality And Reliability Assurance / Handling Precautions |
| TMP93CT76F | Quality And Reliability Assurance / Handling Precautions |
| TMP93CS42AF | Quality And Reliability Assurance / Handling Precautions |
| TMP93CS44F | Quality And Reliability Assurance / Handling Precautions |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP96C031F | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
| TMP96C031N | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
| TMP96C031ZF | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 5V 64PQFP - Bulk |
| TMP96C041AF | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
| TMP96C041AFG | 制造商:Toshiba America Electronic Components 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。