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參數(shù)資料
| 型號(hào)： | TMP95PW64F |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁(yè)數(shù)： | 15/48頁(yè) |
| 文件大?。?/td> | 390K |
| 代理商： | TMP95PW64F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-15
2002-02-20
Table 2.5 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/3)
Products
Name
Air reflow
Infrared reflow
TMP87CH38F
TMP87CK38F
TMP87CM38F
TMP87CP38F
TMP87CS38F
TMP87PS38F
TMP87CM39F
TMP87CP39F
TMP87CS39F
TMP87PS39F
TMPA8700CHF
TMPA8700CKF
TMPA8700CMF
TMPA8700CPF
TMPA8700CSF
TMPA8700PSF
TMPA8701CHF
TMPA8701CKF
TMPA8701CMF
TMP87C840F
TMP87CC40F
TMP87CH40F
TMP87PH40AF
TMP87CK40AF
TMP87CK40F
TMP87CM40AF
TMP87PM40AF
TMP87C841F
TMP87CC41F
TMP87CH41F
TMP87CK41F
TMP87CM41F
TMP87PM41F
TMP87C841U
TMP87CC41U
TMP87CH41U
TMP87CK41U
TMP87CM41U
TMP87PM41U
TMP87C447U
TMP87C847U
TMP87C847LU
TMP87CH47U
TMP87CH47LU
TMP87PH47U
TMP87PH47LU
TMP87CH48U
Note 1:
A(168h)
A(168h)
D(24h)
D(24h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
D(24h)
D(24h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
Note 2:
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