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參數(shù)資料
| 型號： | TMP95PW64F |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 32/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP95PW64F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-32
2002-02-20
4.2
Storage
4.2.1 General Storage
(1)
Avoid storage locations where devices will be exposed to moisture or
direct sunlight.
Follow the instructions printed on the
device cartons regarding transportation and
storage.
The storage area temperature should be
kept within a temperature range of 5°C to
35°C, and relative humidity should be
maintained at between 45% and 75%.
Do not store devices in the presence of
harmful (especially corrosive) gases, or in
dusty conditions.
Use storage areas where there is minimal temperature fluctuation. Rapid
temperature changes can cause moisture to form on stored devices,
resulting in lead oxidation or corrosion. As a result, the solderability of
the leads will be degraded.
When repacking devices, use anti-static containers.
Do not allow external forces or loads to be applied to devices while they
are in storage.
If devices have been stored for more than two years, their electrical
characteristics should be tested and their leads should be tested for ease
of soldering before they are used.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Humidity:
Temperature:
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