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參數(shù)資料
| 型號(hào)： | TMP95PW64F |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁(yè)數(shù)： | 43/48頁(yè) |
| 文件大?。?/td> | 390K |
| 代理商： | TMP95PW64F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-43
2002-02-20
4.5.3 Soldering Temperature Profile
The soldering temperature and heating time vary from device to device.
Therefore, when specifying the mounting conditions, refer to the individual
datasheets and databooks for the devices used.
(1)
Using a Soldering Iron
Complete soldering within ten seconds for lead temperatures of up to
260°C, or within three seconds for lead temperatures up to 350°C.
(2)
Standard Mounting Conditions for SMDs
(Surface Mount Devices)
For details, refer to section 2.1 Mounting Precautions in chapter 2
Handling Precautions for Microcontrollers.
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