![](http://datasheet.mmic.net.cn/390000/TLK2201AI_datasheet_16838151/TLK2201AI_10.png)
TLK2201A, TLK2201AI
ETHERNET TRANSCEIVERS
SLLS572
–
JUNE 2003
10
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions (Continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
GROUND
GNDA
51,58
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
GND
1, 14, 21,
25, 33, 46
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
GNDPLL
64
Ground
PLL ground. Provides a ground for the PLL circuitry.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
DD
(see Note 1)
Input voltage range at TTL terminals, V
I
Input voltage range at any other terminal
Storage temperature, T
stg
Electrostatic discharge
Characterized free-air operating temperature range
Characterized free-air operating temperature range: TLK2201A
–
0.3 V to 3 V
–
0.5 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to V
DD
+0.3 V
–
65
°
C to 150
°
C
CDM: 1 kV, HBM:2 kV
0
°
C to 70
°
C
0
°
C to 70
°
C
–
40
°
C to 85
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . .
TLK2201AI
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
OPERATING FACTOR
ABOVE TA = 25
°
C
5.25 W
46.58 mW/
°
C
3.17 W
23.70 mW/
°
C
2.01 W
13.19 mW/
°
C
PACKAGE
TA
≤
25
°
C
POWER RATING
TA = 70
°
C
POWER RATING
RCP64
§
RCP64
RCP64#
2.89 W
1.74 W
1.11 W
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θ
JA).
§
2 oz. Trace and copper pad with solder.
2 oz. Trace and copper pad without solder.
#Standard JEDEC high-K board
NOTE: For more information, refer to TI application note
PowerPAD Thermally Enhanced
Package,
TI literature number SLMA002.
thermal characteristics
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
21.47
R
θ
JA
Junction-to-free-air thermal resistance
42.20
°
C/W
75.83
0.38
R
θ
JC
Junction-to-case-thermal resistance
0.38
°
C/W
7.8