參數(shù)資料
型號: TIM5053-16SL
廠商: Toshiba Corporation
英文描述: MICROWAVE POWER GaAs FET
中文描述: 微波功率GaAs場效應(yīng)管
文件頁數(shù): 1/4頁
文件大小: 105K
代理商: TIM5053-16SL
MICROWAVE POWER GaAs FET
MICROWAVE SEMICONDUCTOR
TIM5053-16SL
TECHNICAL DATA
FEAT URES
LOW INTERMODULATION DISTORTION
IM3=-45 dBc at Pout= 31.5dBm
Single Carrier Level
HIGH POWER
P1dB=42.5dBm at 5.0GHz to 5.3GHz
RF PERFORMANCE SPECIFICATIONS ( Ta= 25
°
C )
CHARACTERISTICS
SYMBOL
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
I
DS1
Gain Flatness
Δ
G
Power Added Efficiency
η
add
3
rd
Order Intermodulation
Distortion
Drain Current
IDS2
Channel Temperature Rise
Δ
Tch
HIGH GAIN
G1dB=8.5dB at 5.0GHz to 5.3GHz
BROAD BAND INTERNALLY MATCHED FET
HERMETICALLY SEALED PACKAGE
CONDITIONS
UNIT
dBm
MIN. TYP.
41.5
MAX.
P
1dB
42.5
G
1dB
dB
7.5
8.5
A
dB
%
dBc
-42
4.4
35
-45
5.0
±
0.6
VDS=10V
f= 5.0 to 5.3GHz
IM3
Two-Tone Test
Po=31.5dBm
(Single Carrier Level)
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
(Max.)
A
°
C
4.4
5.0
80
Recommended Gate Resistance(Rg) : 100
Ω
ELECTRICAL CHARACTERISTICS ( Ta= 25
°
C )
CHARACTERISTICS
SYMBOL
Transconductance
Gm
CONDITIONS
V
DS
=
3V
I
DS
= 6.0A
V
GSoff
V
DS
=
3V
I
DS
= 60mA
I
DSS
V
DS
=
3V
V
GS
= 0V
V
GSO
I
GS
= -200
μ
A
UNIT
mS
MIN.
TYP.
3600
MAX.
Pinch-off Voltage
V
-1.0
-2.5
-4.0
Saturated Drain Current
A
10.5
Gate-Source Breakdown
Voltage
Thermal Resistance
V
-5
R
th(c-c)
Channel to Case
°
C/W
1.5
2.0
The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Rev. Jul. 2006
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