參數(shù)資料
型號(hào): TIM5359-45SL
廠商: Toshiba Corporation
英文描述: MICROWAVE SEMICONDUCTOR
中文描述: 微波半導(dǎo)體
文件頁數(shù): 1/4頁
文件大?。?/td> 120K
代理商: TIM5359-45SL
MICROWAVE POWER GaAs FET
MICROWAVE SEMICONDUCTOR
TIM5359-45SL
TECHNICAL DATA
FEAT URES
LOW INTERMODULATION DISTORTION
HIGH GAIN
IM3=-45 dBc at Pout= 35.5dBm
Single Carrier Level
HIGH POWER
P1dB=46.5dBm at 5.3GHz to 5.9GHz
RF PERFORMANCE SPECIFICATIONS ( Ta= 25
°
C )
G1dB=9.0dB at 5.3GHz to 5.9GHz
BROAD BAND INTERNALLY MATCHED FET
HERMETICALLY SEALED PACKAGE
CHARACTERISTICS
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
Gain Flatness
Power Added Efficiency
3rd Order Intermodulation
Distortion
SYMBOL
P
1dB
CONDITION
UNIT
dBm
MIN. TYP.
46.0
MAX.
46.5
G
1dB
dB
8.0
9.0
I
DS
Δ
G
η
add
IM
3
A
dB
%
dBc
-42
9.6
41
-45
10.8
±
0.8
VDS= 10V
f = 5.3 to 5.9GHz
Two-Tone Test
Po=35.5dBm
(Single Carrier Level)
Channel Temperature Rise
Δ
Tch
(VDS X IDS + Pin P1dB)
X Rth(c-c)
(Max.)
°
C
100
Recommended Gate Resistance(Rg) : 28
Ω
ELECTRICAL CHARACTERISTICS ( Ta= 25
°
C )
CHARACTERISTICS
Transconductance
SYMBOL
gm
CONDITION
V
DS
=
3V
I
DS
= 11.0A
UNIT
mS
MIN.
TYP.
8000
MAX.
Pinch-off Voltage
V
GSoff
V
DS
=
3V
I
DS
= 170mA
I
DSS
V
DS
=
3V
V
GS
= 0V
V
GSO
I
GS
= -500
μ
A
V
-1.0
-2.5
-4.0
Saturated Drain Current
A
24
Gate-Source Breakdown
Voltage
Thermal Resistance
V
-5
R
th(c-c)
Channel to Case
°
C/W
0.8
1.2
The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Rev. Jul. 2006
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