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參數(shù)資料
| 型號： | TEA1211 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | High efficiency auto-up/down DC/DC converter |
| 中文描述： | 高效率auto-up/down直流/直流轉(zhuǎn)換器 |
| 文件頁數(shù)： | 20/23頁 |
| 文件大?。?/td> | 125K |
| 代理商： | TEA1211 |
2003 Oct 13
20
Philips Semiconductors
Preliminary specification
High efficiency auto-up/down
DC/DC converter
TEA1211HN
13.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar or manual soldering is suitable for PMFP packages.
2.
3.
4.
5.
6.
7.
8.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T
(3)
, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(5)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP
(8)
not suitable
not suitable
(4)
suitable
suitable
suitable
not recommended
(5)(6)
not recommended
(7)
not suitable
suitable
suitable
suitable
not suitable
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