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參數(shù)資料
| 型號： | TEA1200TS |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 0.95 V starting DC-to-DC converter with low battery indicator |
| 中文描述： | 5 A SWITCHING REGULATOR, 720 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封裝： | 4.40 MM, PLASTIC, MO-152, SOT-369-1, SSOP-16 |
| 文件頁數(shù)： | 19/24頁 |
| 文件大?。?/td> | 104K |
| 代理商： | TEA1200TS |
2002 May 14
19
Philips Semiconductors
Product specification
0.95 V starting DC-to-DC converter
with low battery indicator
TEA1200TS
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
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| TEA1201TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:0.95 V starting basic power unit |
| TEA1202 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Battery power unit |
| TEA1202TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Battery power unit |
| TEA1204 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High efficiency DC/DC converter |
| TEA1204T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High efficiency DC/DC converter |
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