參數(shù)資料
型號(hào)： TDA8757
廠商： NXP Semiconductors N.V.
英文描述： Triple 8-bit ADC 170 Msps
中文描述： 三路8位ADC為170 MSPS
文件頁(yè)數(shù)： 33/37頁(yè)
文件大小： 895K
代理商： TDA8757
Philips Semiconductors
TDA8757
Triple 8-bit ADC 170 Msps
Preliminary data
Rev. 07 — 28 February 2002
33 of 37
9397 750 09457
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
15. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe, it is desirable to take normal precautions appropriate
to handling integrated circuits.
16. Soldering
16.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 220
°
C for thick/large
packages, and below 235
°
C small/thin packages.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
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TDA8759HV/8/C1 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 3X8-BITS VIDEO ADC 110MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
TDA8759HV/8/C1,551 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 3X8-BITS VIDEO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
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