
V
REF
2.4V
AMPLK L
AMPLK R
10k
I1
2
I2
160
μ
A
5
μ
A
AGC L
AGC R
To VCA
0
Figure23
4
Vbg 1.2V
V
REF
(2.4V)
10k
10k
GND 0V
400
μ
A
0
Figure24
1
V
REF
2.4V
LEVEL R
LEVEL L
50k
100
μ
A
49k
49k
SW
Audio
0
Figure25
1
V
REF
2.4V
PK IN R
PK IN L
67k
100
μ
A
To Peak Det
0
Figure26
V 12V
V GND
VideoPads
V
DD
5V
GND 5V
DigitalPads
205
A GNDL
A 12V
A GND R
AudioPads
+
BIP
12V
-
Substrate
DZPN1
DZPN1
DZPN1
BIP10vpl
Vmm
Vpp
0
Figure 27
PIN INTERNALCIRCUITRY
(continued)
AMPLK L, AMPLK R, AGC L, AGC R
I2 and I1 from the amplitude detectingmixer.
V
REF
The 400
μ
A source is off during stand-by mode.
LEVEL L, LEVEL R
PK INL, PK IN R
V 12V
Doubledbonded(two bond wires andtwo pads for
one package pin) :
- One pad is connectedto all of the 12V ESDand
video guard rings.
- The second pad is connected to power up the
video block.
V GND
Doubled bonded:
- Onepadis connectedtopower-up allof thevideo
mux and I/O.
- The second pad is only as a low noise GND for
the videoinput.
V
DD
5V,GND 5V
Connected to XTL oscillator and the bulk of the
CMOS logic and 5V ESD.
A GND
Doubled bonded:
- One pad connected to the left VCO, dividers,
mixers and guard ring. the guard connection is
star connecteddirectly to the pad.
- The secondpad is connectedto both AGCamps
and the deemphasis amplifiers, frequency syn-
thesis and FM deviation selectioncircuit for both
channels.
A 12V
Doubled bonded:
- One pad connectedto theESD and guardring.
- The second pad is connected to the main power
for all of the audio parts.
A GND R
Boubledbonded :
- One pad connected to the right VCO, dividers,
mixers and guard ring. The guard connection is
star connecteddirectly to the pad.
- The second pad is connected to the bias block,
audio noise reduction,volume, mux and ESD.
A third bond wire on this pin is connected directly
to the die pad (substrate).
STV0056A
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