°C/W
參數(shù)資料
型號: SM320F28335GHHAEP
廠商: Texas Instruments
文件頁數(shù): 69/167頁
文件大小: 0K
描述: IC DIGITAL SIGNAL CTLR 179-BGA
產(chǎn)品培訓(xùn)模塊: ControlSUITE
Motor Signal Chain Overview
TPS75005 Single IC Power for C2000 MCU
標準包裝: 189
系列: TMS320F28x3x Delfino™, C2000™
核心處理器: C28x
芯體尺寸: 32-位
速度: 150MHz
連通性: CAN,EBI/EMI,I²C,McBSP,SCI,SPI,UART/USART
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 88
程序存儲器容量: 512KB(256K x 16)
程序存儲器類型: 閃存
RAM 容量: 34K x 16
電壓 - 電源 (Vcc/Vdd): 1.805 V ~ 1.995 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 179-LFBGA
包裝: 托盤
產(chǎn)品目錄頁面: 718 (CN2011-ZH PDF)
其它名稱: 296-25243
SPRS581D – JUNE 2009 – REVISED MAY 2012
Table 7-4. Thermal Model 176-pin PTP Results
AIR FLOW
NO.
°C/W(1)
°C/W(2)
°C/W(3)
°C/W(4)
(m/s)(5)
1
R
θJC
Junction-to-case
7.8
9.4
8.6
10.1
N/A
2
R
θJB
Junction-to-board
6.2
9.9
7.1
10.6
N/A
3
R
θJA
Junction-to-free air
21.3
27.9
23.2
30.6
0
4
14.3
20.2
22.6
0.5
5
13.1
18.6
21
1
R
θJMA
Junction-to-moving air
6
12.1
17.4
19.6
2
7
11.2
16.2
18.2
4
8
0.5
0.7
0.8
0
9
0.6
0.9
1
0.5
10
PsiJT
Junction-to-package top
0.7
1
1.1
1
11
0.8
1.1
1.3
2
12
1
1.3
1.5
4
13
6.3
9.5
10.8
0
14
5.9
8.8
9.9
0.5
15
PsiJB
Junction-to-board
5.9
8.7
9.8
1
16
5.8
8.6
9.7
2
17
5.8
8.5
9.6
4
(1)
Simulation data, using a model of a JEDEC defined 2S2P system with a 12 x 12-mm copper pad on the top and bottom copper layers
connected with an 8 x 8 thermal via array and soldered to the package thermal pad. Power dissipation of 1 W assumed, 70°C Ambient
temp assumed. Signal layer copper coverage 20%, inner layer copper coverage 90%. Actual performance will change based on
environment as well as application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal
Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for
Leaded Surface Mount Packages.
(2)
Simulation data, using the same model but with 1 oz. (35
μm) top and bottom copper thickness and 0.5 oz. (18 μm) inner copper
thickness. Power dissipation of 1 W and ambient temp of 70°C assumed.
(3)
Simulation data, 1S1P PCB model with 12 x 12-mm copper pad on the top layer soldered to device thermal pad and connected to the
bottom copper layer (90% copper) with an 8 x 8 thermal via array. Power dissipation of 1 W and ambient temp of 70°C assumed.
Copper thickness 2 oz. (70
μm) top and bottom.
(4)
Simulation data, 1S1P PCB model with 12 x 12-mm copper pad on the top layer soldered to device thermal pad and connected to the
bottom copper layer (90% copper) with an 8 x 8 thermal via array. Power dissipation of 1 W and ambient temp of 70°C assumed.
Copper thickness 1 oz. (35
μm) top and bottom.
(5)
m/s = meters per second
160
Thermal/Mechanical Data
Copyright 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): SM320F28335-EP
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