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參數(shù)資料
| 型號(hào)： | SL1ICS3001U |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | I.CODE1 Label IC Chip Specification |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, UUC4 |
| 封裝： | DIE-4 |
| 文件頁數(shù)： | 16/22頁 |
| 文件大?。?/td> | 376K |
| 代理商： | SL1ICS3001U |
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 16 of 22
14 Hints for Label IC Encapsulation
14.1 Protection against Visible Light
As a result of the ultra low power design of the ICODE1 Label IC some analogue circuits on the
chip are light sensitive. This means that common sun light can impact the operation of the label if
the chip is not protected against visible light radiation.
Measurements have shown that a radiation of E
max
= 60 W/m
2
(spectrum: 400 to 1000 nm) causes a
reduced operating range of the plain chip.
Measurements of direct sunlight in summer deliver values up to 260 W/m
2
.
To ensure proper operation an expected minimum radiation reduction factor of approx. 9
(2 x 260/60 = 8.7) must be provided by the encapsulation. That means special care has to be taken
to ensure a sufficient light protection of the ICODE1 Label IC (e.g. non translucent encapsulation
or underfiller, ...) according to application requirements.
14.2 Protection against UV Light
An EEPROM memory, as it is also used in the ICODE1 Label IC, has some principle sensitivity to
UV light (applies to EEPROM-technology in general).
Thus strong UV exposure in the production of inlets/labels has to be avoided. UV protection has to
be ensured using appropriate assembly methods.
14.3 Resistance to X-Rays
X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long
term influence on the behaviour of the ICs nor on the data retention of the EEPROMs.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SL1ICS3001U/L6D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/N5D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W/N4D | 功能描述:射頻無線雜項(xiàng) ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| SL1ICS3001W/N4D,00 | 功能描述:射頻無線雜項(xiàng) ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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