- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄372148 > SL1ICS3001U (NXP SEMICONDUCTORS) I.CODE1 Label IC Chip Specification PDF資料下載
參數(shù)資料
| 型號(hào)： | SL1ICS3001U |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | I.CODE1 Label IC Chip Specification |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, UUC4 |
| 封裝： | DIE-4 |
| 文件頁數(shù)： | 11/22頁 |
| 文件大?。?/td> | 376K |
| 代理商： | SL1ICS3001U |
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 11 of 22
8 Documentation
8.1 Delivery Documentation
Each wafer container and each larger shipment container is individually marked with the
identification information as follows:
Diffusion Batch number (wafer lot number)
Part designation (type) with revision number
Ordering code (see chapter 4)
Date code of lot acceptation
Good die quantity
The print out of the final test results is attached to the packing and contains the good die quantity
related to every wafer number.
8.2 Fail-Die Identification
Every die is electrically tested according to data sheet. Identification of chips, which do not confirm
with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at
wafer periphery are identified by ‘FAIL’).
8.2.1 Ink Dot Specification
Diameter:
Height:
Colour:
Position:
Attributes:
min. 0.4 mm
max. 20 μm
black
central third of die (x, y direction)
opaque, water resistant
NOTE:
Uncompleted dies with an area < 95 % (wafer periphery) are not inked!
8.2.2 Wafer Mapping
Wafer mapping for failed die identification is available on Floppy-Disk.
Format:
Electroglas ESC–ASCEND on 3.5
″
Floppy-Disk
NOTE: The wafer map refers to unsawn wafers. At sawn wafers (on FFC) additional ICs
might be inked (marked as fail) if damaged during the sawing process (compared to
wafer map)!
See Appendix D for an example of the wafer map.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SL1ICS3101 | I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U | I.CODE1 Label IC 97pF Chip Specification |
| SL2055 | PREAMPLIFIER FOR REMOTE CONTROL USE |
| SL3ICS30 | UCODE HSL |
| SL3S30 | UCODE HSL |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SL1ICS3001U/L6D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/N5D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W/N4D | 功能描述:射頻無線雜項(xiàng) ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| SL1ICS3001W/N4D,00 | 功能描述:射頻無線雜項(xiàng) ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。