
SiI
1161
PanelLink Receiver
Data Sheet
41
SiI
-DS-0096-D
Dimensions and Marking
100-pin TQFP Package Dimensions and Marking Specification
SiI
1161CTU
LLLLLL.LLLL
YYWW
TTTTTTmm
Device #
Lot #
Date Code
Revision Code
TMDS
E1
F1
D1
G1
A
2
A
1
L1
c
e
b
Pin 1
Designator
JEDEC Package Code
MS026-AED-HD
Thickness
Stand-off
Body Thickness
Body Size
Body Size
Footprint
Footprint
Lead Length
Lead Width
Lead Thickness
Lead Pitch
typ
0.10
1.00
14.00
14.00
16.00
16.00
1.00
0.20
0.50
max
1.20
0.15
1.05
0.20
A
A1
A2
D1
E1
F1
G1
L1
b
c
e
Dimensions in millimeters.
Overall thickness A=A1+A2.
Device
Standard
Pb-free
Device Number
SiI1161CT100
SiI
1161CTU
Legend
LLLLLL.LLLL
YY
WW
TTTTTT
mm
Description
Lot Number
Year of Mfr
Week of Mfr
Trace Code
Maturity Code
0: engineering samples
=1: pre-production
>1: production
Figure 32. Package Diagram
Note: The marking specification for the SiI-1161 was updated January 1, 2004. Please refer to Product Change
Notice (SiI-PC-0044) “Marking standard for 1161 and 1151”, for information on SiI-1161 parts manufactured prior
to December 31, 2003. SiI-PC-0044 covers parts with Date Codes of 0301 through 0352.
Ordering Information
Standard Part Number:
Pb-free Part Number:
Note: All Silicon Image Pb-free (Universal) packages are also rated for the standard Sn/Pb reflow process. Please
refer to the document (SiI-CM-0058) “Reflow Temperature Profile of Standard Leaded and Lead-free or Green
Packages”, for more details.
SiI
1161CT100
SiI
1161CTU (‘U’ designates universal lead-free packaging)