參數資料
型號： SII1161
廠商： Silicon Image, Inc.
英文描述： PanelLink Receiver
中文描述： PanelLink接收機
文件頁數： 44/46頁
文件大?。?/td> 398K
代理商： SII1161
SiI
1161
PanelLink Receiver
Data Sheet
SiI
-DS-0096-D
40
Application-Specific Thermal Calculations
The junction temperature of the silicon is the limiting factor to the performance of this device. Junction
temperature may be calculated as shown in Equation 1, where the input factors are:
T
A
Ambient temperature.
Θ
JA
Junction-to-Ambient thermal resistance (see page 3).
V
CC
Power supply voltage (see page 3).
CC
Power supply current (see page 4).
T
J
must not exceed the limit shown in the Absolute Maximum specifications on page 3
T
T
=
CC
I
CC
JA
A
J
V
×
×
+
θ
Equation 1. Junction Temperature Calculation
The temperature rise, from ambient to junction (Figure 31), is a function of the power demanded by the operation
of the device, and the thermal resistance of the device. Power consumption is a function of the pixel frequency.
Thermal resistance is a function of the soldered use of the package’s ePad.
0.00
10.00
20.00
30.00
40.00
50.00
60.00
70.00
25
40
65
108
135
165
RxC Frequency (MHz)
ePad 20% soldered
T
ePad 100% soldered
ePad unsoldered
Figure 31. Temperature Rise with Frequency and ePad
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