參數(shù)資料
型號(hào)： SC16C654BIBM
廠商： NXP Semiconductors N.V.
元件分類： 收發(fā)器
英文描述： 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.), with 64-byte FIFOs and infrared (IrDA) encoder-decoder
封裝： SC16C654BIA68<SOT188-2 (PLCC68)|<<http://www.nxp.com/packages/SOT188-2.html<1<Always Pb-free,;SC16C654BIA68<SOT188-2 (PLCC68)|<<http://www.nxp.com/packages/SOT188-2.html&
文件頁數(shù)： 55/58頁
文件大?。?/td> 302K
代理商： SC16C654BIBM
9397 750 14965
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 20 June 2005
55 of 58
Philips Semiconductors
SC16C654B/654DB
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
13. Abbreviations
Table 30:
Acronym
BRG
CPU
DMA
FIFO
ISDN
LSB
MSB
QUART
UART
Abbreviations
Description
Baud Rate Generator
Central Processing Unit
Direct Memory Access
First-In, First-Out
Integrated Service Digital Network
Least Significant Bit
Most Significant Bit
4-channel (Quad) Universal Asynchronous Receiver and Transmitter
Universal Asynchronous Receiver and Transmitter
相關(guān)PDF資料
PDF描述
SC16C654BIBS 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.), with 64-byte FIFOs and infrared (IrDA) encoder-decoder
SC16C654DBIB64 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.), with 64-byte FIFOs and infrared (IrDA) encoder-decoder
SC16C750BIA44 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs
SC16C750BIB64 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs
SC16C750BIBS 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C654BIBM,128 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C654BIBM,151 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C654BIBM,157 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C654BIBM151 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
SC16C654BIBM-F 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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