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參數(shù)資料
| 型號： | SC16C652B |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 5V, 3.3 V and 2.5V dual UART, 5 Mbit/s (max.),with 32-byte FIFOs and infrared(IrDA) encoder/decoder |
| 中文描述： | 5V的，3.3V和2.5V雙，5兆的UART /秒（最大），32字節(jié)的FIFO和紅外線（IrDA）編碼器/解碼器 |
| 文件頁數(shù)： | 42/44頁 |
| 文件大?。?/td> | 205K |
| 代理商： | SC16C652B |
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Philips Semiconductors
SC16C652B
Dual UART with 32-byte FIFOs and IrDA encoder/decoder
Product data
Rev. 03 — 10 December 2004
42 of 44
9397 750 14452
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
13. Revision history
Table 31:
Rev Date
03
Revision history
CPCN
20041210
Description
Product data (9397 750 14452)
Modifications:
There is no modification to the data sheet. However, reader is advised to refer to
AN10333 (Rev. 02) “SC16CXXXB baud rate deviation tolerance” (9397 750 14411)
that was released together with this revision.
Product data (9397 750 13123). Supersedes data of 20040326 (9397 750 11972).
Product data (9397 750 11972).
-
02
01
20040617
20040326
-
-
相關PDF資料 |
PDF描述 |
|---|---|
| SC16C652 | Dual UART with 32 bytes of transmit and receive FIFOs |
| SC16C652IB48 | Dual UART with 32 bytes of transmit and receive FIFOs |
| SC16C654IB64 | Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C654 | Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C654BIEC | 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.), with 64-byte FIFOs and infrared (IrDA) encoder/decoder |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C652BIB48 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 32B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C652BIB48,128 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C652BIB48,151 | 功能描述:UART 接口集成電路 2CH. UART 32B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C652BIB48,157 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C652BIB48151 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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