參數(shù)資料
型號(hào)： SC16C550BIN40
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： 5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
中文描述： 1 CHANNEL(S), 3M bps, SERIAL COMM CONTROLLER, PDIP40
封裝： 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40
文件頁(yè)數(shù)： 43/47頁(yè)
文件大?。?/td> 229K
代理商： SC16C550BIN40
Philips Semiconductors
SC16C550B
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
Product data
Rev. 02 — 14 December 2004
43 of 47
9397 750 14446
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
12.3.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
12.3.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
相關(guān)PDF資料
PDF描述
SC16C550IN40 Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder
SC16C550 Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder
SC16C550IA44 Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder
SC16C550IB48 Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder
SC16C554IB64 Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C550BIN40,112 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IA44 制造商:NXP Semiconductors 功能描述:UART 16BYTE FIFO 16C550 PLCC44
SC16C550IA44,512 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IA44,518 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IA44,529 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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