參數(shù)資料
型號(hào)： SC16C2550BIB48
廠商： NXP Semiconductors N.V.
元件分類： 收發(fā)器
英文描述： 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit-s (max.), with 16-byte FIFOs
封裝： SC16C2550BIA44<SOT187-2 (PLCC44)|<<http://www.nxp.com/packages/SOT187-2.html<1<week 51, 2004,;SC16C2550BIA44<SOT187-2 (PLCC44)|<<http://www.nxp.com/packages/SOT187-2.html
文件頁(yè)數(shù)： 39/43頁(yè)
文件大小： 211K
代理商： SC16C2550BIB48
SC16C2550B_5
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 12 January 2009
39 of 43
NXP Semiconductors
SC16C2550B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”
13. Soldering of through-hole mount packages
13.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
13.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°
C or 265
°
C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
13.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°
C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°
C and 400
°
C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C2550BIB48,128 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550BIB48,151 功能描述:UART 接口集成電路 2CH. UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550BIB48,157 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550BIB48-S 功能描述:UART 接口集成電路 2CH. UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550BIBS 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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