參數(shù)資料
型號(hào)： SAA5532PS/NNNN
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 微控制器/微處理器
英文描述： 8-BIT, OTPROM, 12 MHz, MICROCONTROLLER, PDIP52
封裝： 0.600 INCH, PLASTIC, SDIP-52
文件頁(yè)數(shù)： 13/100頁(yè)
文件大小： 412K
代理商： SAA5532PS/NNNN
2000 Feb 23
2
Philips Semiconductors
Preliminary specication
Enhanced TV microcontrollers with
On-Screen Display (OSD)
SAA55xx
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
QUICK REFERENCE DATA
4
ORDERING INFORMATION
5
BLOCK DIAGRAM
6
PINNING INFORMATION
6.1
Pinning
6.2
Pin description
7
MICROCONTROLLER
7.1
Microcontroller features
8
MEMORY ORGANIZATION
8.1
ROM bank switching
8.2
Security bits - program and verify
8.3
RAM organisation
8.4
Data memory
8.5
SFR memory
8.6
Character set feature bits
8.7
External (Auxiliary) memory
9
POWER-ON RESET
10
REDUCED POWER MODES
10.1
Idle mode
10.2
Power-down mode
10.3
Standby mode
11
I/O FACILITY
11.1
I/O ports
11.2
Port type
11.3
Port alternative functions
11.4
LED support
12
INTERRUPT SYSTEM
12.1
Interrupt enable structure
12.2
Interrupt enable priority
12.3
Interrupt vector address
12.4
Level/edge interrupt
13
TIMER/COUNTER
14
WATCHDOG TIMER
14.1
Watchdog Timer operation
15
PULSE WIDTH MODULATORS
15.1
PWM control
15.2
Tuning Pulse Width Modulator (TPWM)
15.3
Software ADC (SAD)
16
I2C-BUS SERIAL I/O
16.1
I2C-bus port selection
17
MEMORY INTERFACE
17.1
Memory structure
17.2
Memory mapping
17.3
Addressing memory
17.4
Page clearing
18
DATA CAPTURE
18.1
Data Capture features
19
DISPLAY
19.1
Display features
19.2
Display modes
19.3
Display feature descriptions
19.4
Character and attribute coding
19.5
Screen and global controls
19.6
Screen colour
19.7
Text display controls
19.8
Soft scroll action
19.9
Display positioning
19.10
Character set
19.11
ROM addressing
19.12
Redefinable characters
19.13
Display synchronization
19.14
Video/data switch (Fast Blanking) polarity
19.15
Video/Data switch adjustment
19.16
RGB brightness control
19.17
Contrast reduction
20
MEMORY MAPPED REGISTERS (MMR)
21
LIMITING VALUES
22
CHARACTERISTICS
23
QUALITY AND RELIABILITY
23.1
Group A
23.2
Group B
23.3
Group C
24
APPLICATION INFORMATION
25
EMC GUIDELINES
26
REFERENCES
27
PACKAGE OUTLINE
28
SOLDERING
28.1
Introduction to soldering through-hole mount
packages
28.2
Soldering by dipping or by solder wave
28.3
Manual soldering
28.4
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
29
DEFINITIONS
30
LIFE SUPPORT APPLICATIONS
31
PURCHASE OF PHILIPS I2C COMPONENTS
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