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參數(shù)資料
| 型號： | SA58670 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 2.1 W/channel stereo Class D audio amplifier |
| 中文描述： | 2.1瓦/聲道立體聲D類音頻放大器 |
| 文件頁數(shù)： | 14/18頁 |
| 文件大?。?/td> | 142K |
| 代理商： | SA58670 |
SA58670_1
NXP B.V. 2007. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2007
14 of 18
NXP Semiconductors
SA58670
2.1 W/channel stereo Class D audio amplifier
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 8
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
and
8
Table 7.
Package thickness (mm)
Table 8.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 8
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58670_08 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.1 W/channel stereo class-D audio amplifier |
| SA58670A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.1 W/channel stereo class-D audio amplifier |
| SA58670ABS | 制造商:NXP Semiconductors 功能描述:AMP AUDIO 2.1W STER D 20HVQFN 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 2.1W, STER, D, 20HVQFN |
| SA58670ABS,115 | 功能描述:音頻放大器 2.1W/CH CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58670ABS115 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 2.1W QFN-20 |
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