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參數(shù)資料
| 型號(hào)： | SA58670 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 2.1 W/channel stereo Class D audio amplifier |
| 中文描述： | 2.1瓦/聲道立體聲D類(lèi)音頻放大器 |
| 文件頁(yè)數(shù)： | 13/18頁(yè) |
| 文件大?。?/td> | 142K |
| 代理商： | SA58670 |
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SA58670_1
NXP B.V. 2007. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2007
13 of 18
NXP Semiconductors
SA58670
2.1 W/channel stereo Class D audio amplifier
13. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58670_08 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:2.1 W/channel stereo class-D audio amplifier |
| SA58670A | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:2.1 W/channel stereo class-D audio amplifier |
| SA58670ABS | 制造商:NXP Semiconductors 功能描述:AMP AUDIO 2.1W STER D 20HVQFN 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 2.1W, STER, D, 20HVQFN |
| SA58670ABS,115 | 功能描述:音頻放大器 2.1W/CH CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58670ABS115 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 2.1W QFN-20 |
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