參數(shù)資料
型號(hào): S75WS256NDFBAWLK0
廠商: SPANSION LLC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA84
封裝: 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84
文件頁數(shù): 8/15頁
文件大小: 235K
代理商: S75WS256NDFBAWLK0
6
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005
P r e l i m i n a r y
4 MCP Block Diagram
Notes:
1.
MRS is only present in RAM Type 4.
2.
CE#f1, CE#f2, and CE#f3 are the chip enable pins for the first, second and third Flash devices, respectively.
Figure 4.1 MCP Block Diagram 1
A0-A22
A0-A22
A23
A23
RDY
RDY
DQ0-DQ15
CLK
AVD#
F1-CE#
OE#
F-RST#
F-ACC
F1-WP#
F-WE#
CLK
AVD#
CE#
OE#
RESET#
ACC
WP#
WE#
VSS
VSS
VCC
VCCQ
F-VCC
F-VCCQ
A0-A22
WAIT#
CLK
AVD#
CE#
OE#
R-CE#
R-LB#
R-UB#
LB#
UB#
WE#
MRS#
R-MRS#
VSS
VCC
VCCQ
R-VCC
R-VCCQ
A0-A22
A23
RDY
CLK
AVD#
CE#
OE#
RESET#
ACC
WP#
WE#
F2-CE#
FD-WP#
VSS
VCC
VCCQ
A0-A22
A23
RDY
CLK
AVD#
CE#
OE#
RESET#
ACC
WP#
WE#
F3-CE#
VSS
VCC
VCCQ
DQ0-DQ15
DQ0-DQ15
DQ0-DQ15
DQ0-DQ15
WS256N
Flash
Memory
128Mb
Memory
WS256N
Flash
Memory
WS256N
Flash
Memory
v
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