參數(shù)資料
型號(hào): S75WS256NDFBAWLK0
廠商: SPANSION LLC
元件分類(lèi): 存儲(chǔ)器
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA84
封裝: 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84
文件頁(yè)數(shù): 14/15頁(yè)
文件大小: 235K
代理商: S75WS256NDFBAWLK0
12
S75WS-N Based MCPs
S75WS_02_A2 October 6, 2005
A d v a n c e I n f o r m a t i o n
6 MCP Revisions
Revision A0 (February 17, 2005)
Initial Release
Revision A1 (September 8, 2005)
Global
Removed references to the S29RS-N data sheet
Product Selector Guide
Updated table and added 80 MHz options
Ordering I nformation
Updated table with new options
MCP Configurations and Valid Combinations
Updated table to reflect new options
I nput/ Output Descriptions
Updated table and changed some pin names
MCP Block Diagram
Updated the illustration
Connection Diagram
Updated the pinout diagram
Physical Dimensions
Added the FEA084 package diagram
Look-Ahead Connection Diagram
Removed from data sheet
S29W S-N Flash Module
Updated to the latest revision
Revision A2 (October 6, 2005)
Global
Added ORNAND Flash information
Product Selector Guide
Added ORNAND options
Ordering I nformation
Updated table with new options
MCP Block Diagram
Added the ORNAND illustration
Connection Diagram
Added the pinout diagram for the ORNAND device
Physical Dimensions
Added the FND115 package diagram
相關(guān)PDF資料
PDF描述
S75WS256NDFBFWLJ0 Stacked Multi-Chip Product (MCP)
S75WS256NDFBFWLJ2 Stacked Multi-Chip Product (MCP)
S75WS256NDFBFWLJ3 Stacked Multi-Chip Product (MCP)
S75WS256NDFBFWLK0 Stacked Multi-Chip Product (MCP)
S75WS256NDFBFWLK2 Stacked Multi-Chip Product (MCP)
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